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SMX LM317 THREE-TERMINAL ADJUSTABLE OUTPUT POSITIVE VOLTAGE REGULATOR same as Texas Instruments LM317, BayLinear LM317, Fairchild Semiconductor LM317AHVT, Fairchild Semiconductor LM317AHV, Fairchild Semiconductor LM317LMX, Fairchild Semiconductor LM317L, Fairchild Semiconductor LM317LZ, Fairchild Semiconductor LM317LZX, Fairchild Semiconductor LM317LZXA, Fairchild Semiconductor LM317M, Fairchild Semiconductor LM317, Fairchild Semiconductor LM317MDTXM, Fairchild Semiconductor LM317LM, Fairchild Semiconductor LM317MDTX, Linear Technology LM317, Motorola LM317LZ, Motorola LM317LBZ, Motorola LM317LBD, Motorola LM317LD, National Semiconductor LM317K STEEL, National Semiconductor LM317K MWC, National Semiconductor LM317K MDC, National Semiconductor LM317HVT, National Semiconductor LM317HVK STEEL, National Semiconductor LM317HVH, National Semiconductor LM317HV, National Semiconductor LM317L, National Semiconductor LM317L MDA, National Semiconductor LM317MDTX, National Semiconductor LM317MDT, National Semiconductor LM317LZ, National Semiconductor LM317LMX, National Semiconductor LM317LM, National Semiconductor LM317LIBPX, National Semiconductor LM317LIBP, National Semiconductor LM317L MWA, National Semiconductor LM317H, National Semiconductor LM317EMPX, National Semiconductor LM317AH, National Semiconductor LM317AMDT, National Semiconductor LM317AEMP, National Semiconductor LM317AMDTX, National Semiconductor LM317A MWC, National Semiconductor LM317A, National Semiconductor LM317AEMPX, National Semiconductor LM317AT, National Semiconductor LM317, National Semiconductor LM317DT, National Semiconductor LM317EMP, ON Semiconductor LM317LZG, ON Semiconductor LM317LZ, ON Semiconductor LM317LZG, ON Semiconductor LM317LZRA, ON Semiconductor LM317LZ, ON Semiconductor LM317LZRA, ON Semiconductor LM317MDTRK, ON Semiconductor LM317LDR2G, ON Semiconductor LM317LDR2G, ON Semiconductor LM317LDR2, ON Semiconductor LM317LDR2, ON Semiconductor LM317LDG, ON Semiconductor LM317LDG, ON Semiconductor LM317LZRAG, ON Semiconductor LM317LZRAG, ON Semiconductor LM317LZRP, ON Semiconductor LM317MBSTT3, ON Semiconductor LM317MBT, ON Semiconductor LM317M-D, ON Semiconductor LM317MDT, ON Semiconductor LM317MDTG, ON Semiconductor LM317MDTG, ON Semiconductor LM317MDTG, ON Semiconductor LM317MDTRKG, ON Semiconductor LM317MBDTRKG, ON Semiconductor LM317MBDTRK, ON Semiconductor LM317MBDT, ON Semiconductor LM317LZRP, ON Semiconductor LM317LZRPG, ON Semiconductor LM317LZRPG, ON Semiconductor LM317M, ON Semiconductor LM317MABDT, ON Semiconductor LM317MABDTRK, ON Semiconductor LM317MABT, ON Semiconductor LM317MADTRK, ON Semiconductor LM317, ON Semiconductor LM317LBZRA, ON Semiconductor LM317D2T, ON Semiconductor LM317LBZ, ON Semiconductor LM317BT, ON Semiconductor LM317LBDR2, ON Semiconductor LM317LBDG, ON Semiconductor LM317LBDG, ON Semiconductor LM317LBD, ON Semiconductor LM317LBD, ON Semiconductor LM317BTG, ON Semiconductor LM317LBDR2, ON Semiconductor LM317L, ON Semiconductor LM317L, ON Semiconductor LM317-D, ON Semiconductor LM317LBZ, ON Semiconductor LM317LBZRA, ON Semiconductor LM317BD2T, ON Semiconductor LM317LD, ON Semiconductor LM317LD, ON Semiconductor LM317BD2TR4, ON Semiconductor LM317L-D, ON Semiconductor LM317D2TR4, ON Semiconductor LM317D2TG, ON Semiconductor LM317LBZRP, ON Semiconductor LM317LBZRP, SGS Thomson Microelectronics LM317M, SGS Thomson Microelectronics LM317, SGS Thomson Microelectronics LM317LD, SGS Thomson Microelectronics LM317L, SGS Thomson Microelectronics LM317MDT, SGS Thomson Microelectronics LM317K, SGS Thomson Microelectronics LM317D2T, SGS Thomson Microelectronics LM317LZ, ST Microelectronics LM317MDT-TR, ST Microelectronics LM317D2T, ST Microelectronics LM317K, ST Microelectronics LM317D2T-TR, ST Microelectronics LM317, ST Microelectronics LM317MDT, ST Microelectronics LM317LD13TR, ST Microelectronics LM317LZ-TR, ST Microelectronics LM317LD, ST Microelectronics LM317L, ST Microelectronics LM317LZ-AP, ST Microelectronics LM317M, ST Microelectronics LM317LZ, Texas Instruments LM317LCDR, Texas Instruments LM317MDCY, Texas Instruments LM317M, Texas Instruments LM317LCLP, Texas Instruments LM317LCPWR, Texas Instruments LM317DCY, Texas Instruments LM317DCYR, Texas Instruments LM317MKTP, Texas Instruments LM317LCD, Texas Instruments LM317LCPW, Texas Instruments LM317L, Texas Instruments LM317, Texas Instruments LM317KTER, Texas Instruments LM317KCS, Texas Instruments LM317LCLPR, Texas Instruments LM317MDCYR, Texas Instruments LM317KC, Texas Instruments LM317-TI, Vishay LM317, Wing Shing Computer Components LM317 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
BayLinear LM317, Fairchild Semiconductor LM317, Linear Technology LM317, Motorola LM317LBD, National Semiconductor LM317, ON Semiconductor LM317, SGS Thomson Microelectronics LM317, ST Microelectronics LM317, Texas Instruments LM317, Vishay LM317, Wing Shing Computer Components LM317
SMX LM317 THREE-TERMINAL ADJUSTABLE OUTPUT POSITIVE VOLTAGE REGULATOR same as Texas Instruments LM317, BayLinear LM317, Fairchild
Semiconductor LM317AHVT, Fairchild Semiconductor LM317AHV, Fairchild Semiconductor LM317LMX, Fairchild Semiconductor LM317L, Fairchild
Semiconductor LM317LZ, Fairchild Semiconductor LM317LZX, Fairchild Semiconductor LM317LZXA, Fairchild Semiconductor LM317M, Fairchild
Semiconductor LM317, Fairchild Semiconductor LM317MDTXM, Fairchild Semiconductor LM317LM, Fairchild Semiconductor LM317MDTX, Linear
Technology LM317, Motorola LM317LZ, Motorola LM317LBZ, Motorola LM317LBD, Motorola LM317LD, National Semiconductor LM317K STEEL, National
Semiconductor LM317K MWC, National Semiconductor LM317K MDC, National Semiconductor LM317HVT, National Semiconductor LM317HVK STEEL,
National Semiconductor LM317HVH, National Semiconductor LM317HV, National Semiconductor LM317L, National Semiconductor LM317L MDA, National
Semiconductor LM317MDTX, National Semiconductor LM317MDT, National Semiconductor LM317LZ, National Semiconductor LM317LMX, National
Semiconductor LM317LM, National Semiconductor LM317LIBPX, National Semiconductor LM317LIBP, National Semiconductor LM317L MWA, National
Semiconductor LM317H, National Semiconductor LM317EMPX, National Semiconductor LM317AH, National Semiconductor LM317AMDT, National
Semiconductor LM317AEMP, National Semiconductor LM317AMDTX, National Semiconductor LM317A MWC, National Semiconductor LM317A, National
Semiconductor LM317AEMPX, National Semiconductor LM317AT, National Semiconductor LM317, National Semiconductor LM317DT, National
Semiconductor LM317EMP, ON Semiconductor LM317LZG, ON Semiconductor LM317LZ, ON Semiconductor LM317LZG, ON Semiconductor LM317LZRA, ON
Semiconductor LM317LZ, ON Semiconductor LM317LZRA, ON Semiconductor LM317MDTRK, ON Semiconductor LM317LDR2G, ON Semiconductor LM317LDR2G,
ON Semiconductor LM317LDR2, ON Semiconductor LM317LDR2, ON Semiconductor LM317LDG, ON Semiconductor LM317LDG, ON Semiconductor LM317LZRAG,
ON Semiconductor LM317LZRAG, ON Semiconductor LM317LZRP, ON Semiconductor LM317MBSTT3, ON Semiconductor LM317MBT, ON Semiconductor
LM317M-D, ON Semiconductor LM317MDT, ON Semiconductor LM317MDTG, ON Semiconductor LM317MDTG, ON Semiconductor LM317MDTG, ON Semiconductor
LM317MDTRKG, ON Semiconductor LM317MBDTRKG, ON Semiconductor LM317MBDTRK, ON Semiconductor LM317MBDT, ON Semiconductor LM317LZRP, ON
Semiconductor LM317LZRPG, ON Semiconductor LM317LZRPG, ON Semiconductor LM317M, ON Semiconductor LM317MABDT, ON Semiconductor LM317MABDTRK,
ON Semiconductor LM317MABT, ON Semiconductor LM317MADTRK, ON Semiconductor LM317, ON Semiconductor LM317LBZRA, ON Semiconductor LM317D2T,
ON Semiconductor LM317LBZ, ON Semiconductor LM317BT, ON Semiconductor LM317LBDR2, ON Semiconductor LM317LBDG, ON Semiconductor LM317LBDG,
ON Semiconductor LM317LBD, ON Semiconductor LM317LBD, ON Semiconductor LM317BTG, ON Semiconductor LM317LBDR2, ON Semiconductor LM317L, ON
Semiconductor LM317L, ON Semiconductor LM317-D, ON Semiconductor LM317LBZ, ON Semiconductor LM317LBZRA, ON Semiconductor LM317BD2T, ON
Semiconductor LM317LD, ON Semiconductor LM317LD, ON Semiconductor LM317BD2TR4, ON Semiconductor LM317L-D, ON Semiconductor LM317D2TR4, ON
Semiconductor LM317D2TG, ON Semiconductor LM317LBZRP, ON Semiconductor LM317LBZRP, SGS Thomson Microelectronics LM317M, SGS Thomson
Microelectronics LM317, SGS Thomson Microelectronics LM317LD, SGS Thomson Microelectronics LM317L, SGS Thomson Microelectronics LM317MDT,
SGS Thomson Microelectronics LM317K, SGS Thomson Microelectronics LM317D2T, SGS Thomson Microelectronics LM317LZ, ST Microelectronics
LM317MDT-TR, ST Microelectronics LM317D2T, ST Microelectronics LM317K, ST Microelectronics LM317D2T-TR, ST Microelectronics LM317, ST
Microelectronics LM317MDT, ST Microelectronics LM317LD13TR, ST Microelectronics LM317LZ-TR, ST Microelectronics LM317LD, ST
Microelectronics LM317L, ST Microelectronics LM317LZ-AP, ST Microelectronics LM317M, ST Microelectronics LM317LZ, Texas Instruments
LM317LCDR, Texas Instruments LM317MDCY, Texas Instruments LM317M, Texas Instruments LM317LCLP, Texas Instruments LM317LCPWR, Texas
Instruments LM317DCY, Texas Instruments LM317DCYR, Texas Instruments LM317MKTP, Texas Instruments LM317LCD, Texas Instruments LM317LCPW,
Texas Instruments LM317L, Texas Instruments LM317, Texas Instruments LM317KTER, Texas Instruments LM317KCS, Texas Instruments LM317LCLPR,
Texas Instruments LM317MDCYR, Texas Instruments LM317KC, Texas Instruments LM317-TI, Vishay LM317, Wing Shing Computer Components LM317
manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete
semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of
Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and
integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or
copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on
board, assembled via flip chip or chip and wire. BayLinear LM317, Fairchild Semiconductor LM317, Linear Technology LM317, Motorola
LM317LBD, National Semiconductor LM317, ON Semiconductor LM317, SGS Thomson Microelectronics LM317, ST Microelectronics LM317, Texas
Instruments LM317, Vishay LM317, Wing Shing Computer Components LM317 REGISTER-LOGIN PRODUCTS CROSS REFERENCE
/cgi-bin/stock.pl?part=LM317">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLM317&c_item_1=">REQUEST QUOTE
smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip
technology SMX LM317 - BARE DIE GOLD CHIP TECHNOLOGY™ THREE-TERMINAL ADJUSTABLE OUTPUT POSITIVE VOLTAGE REGULATOR FEATURES APPLICATIONS
VOLTAGE REGULATOR Output Current in Excess of 500mA Output Adjustable between 1.2V and 37V Internal Thermal Overload Protection Internal
Short Circuit Current Limiting Output Transistor Safe-Area Compensation Floating Operation for High Voltage Applications In DIE form, this
device is an excellent selection for many chip and wire HYBRID CIRCUITS. LM317 LM317 THREE-TERMINAL ADJUSTABLE OUTPUT POSITIVE VOLTAGE
REGULATOR SMXLM317 THREE-TERMINAL ADJUSTABLE OUTPUT POSITIVE VOLTAGE REGULATOR - PRODUCT DESCRIPTION The SMX LM317 is an adjustable
three-terminal positive voltage regulator capable of supplying in excess of 500 mA over an output voltage range of 1.2 V to 37 V. This
voltage regulator is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, it employs
internal current limiting, thermal shutdown and safe area compensation, making it essentially blow-out proof. The USM317 serves a wide
variety of applications including local, on-card regulation. This device also makes an especially simple adjustable switching regulator, a
programmable output regulator, or by connecting a fixed resistor between the adjustment and output, the USM317 cam be used as a precision
current regulator. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package)
are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be
easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time,
easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also
harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot
withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build
with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered
industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials
that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components
as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS
MANUFACTURING PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor
manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation,
platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN
or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom
complex device solutions. SCHEMATIC DIAGRAM LM317 Texas Instruments LM317 THREE-TERMINAL ADJUSTABLE OUTPUT POSITIVE VOLTAGE REGULATOR LM317
MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Input-Output Voltage Differential Vi-Vo 40 Vdc Operating Ambient Temperature Range Tj -40 to
+125 °C Storage Temperature Range Tstg -65 to +150 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond
listed absolute maximum ratings may cause permanent damage to the device. LM317 ELECTRICAL CHARACTERISTIC 55°C<Tj<+150°C, Vi = 14V, Io =
550mA, Ci = 0.33µF, Co= 0.1µF, unless otherwise specified PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Line Regulation (Note 2)
TA=25°C, 3.0V≤VI-VO≤40V Regline 0.01 0.04 %/V Line Regulation (Note 2) TA=25°C, 10mA≤IO ≤0.5A VO≤ 5.0V VO ≥5.0V Regload 5.0 0.1 25 0.5 mV
%VO Adjustment Pin Current IAdj 50 100 µA Adjustment Pin Current Change 2.5V≤VI-VO≤ 40V, 10mA≤IL≤0.5A, PD≤Pmax DIAdj 0.2 5.0 µA Reference
Voltage 3.0V≤VI-VO≤ 40V, 10mA≤IL≤0.5A, PD≤Pmax Vref 1.200 1.250 1.300 V Line Regulation (Note 2) 3.0V≤VI-VO≤ 40V, Regline 0.02 0.07 %/V
Load Regulation (Note 2) 10mA≤IO≤0.5A VO≤5.0V VO ≥5.0V Regload 20 0.3 70 1.5 mV %VO Temperature Stability Tlow≤TJ≤Thigh TS 0.7 %VO Minimum
Load Current to Maintain Regulation VI-VO = 40V ILmin 3.5 10 mA Maximum Output Current VI-VO≤15V, PD≤Pmax VI-VO≤15V, PD≤Pmax, TA=25°C Imax
0.5 0.15 0.9 0.25 A RMS Noise, % of VO TA=25°C, 10 Hz N 0.003 % VO Ripple Rejection VO = 10 V, f = 120 Hz (Note 3) Without CAdj CAdj = 10
mF RR - 66 65 80 dB Long-Term Stability, TJ = Thigh (Note 4) TJ = Thigh (Note 4) TA=25°C for Endpoint Measurements S 0.3 1.0 %1.0k Hrs.
(NOTE 1) Tlow to Thigh = 0°C for USM LM317 (NOTE 2) Load and line regulation are specified at constant junction temperature. Changes in VO
due to heating effects must be taken into account separately. Pulse testing with low duty cycle is used. (NOTE 3) CAdj, when used, is
connected between the adjustment pin and ground. (NOTE 4) Since Long-Term Stability cannot be measured on each device before shipment, this
specification is an engineering estimated of average stability from lot to lot. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION
Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 96.457 x 72.835 ±1 [2.45 x 1.85] min 4x4 mils,
1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LM317 DIE
LAYOUT - MECHANICAL SPECIFICATIONS LM317 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 ADJ 83.465 2.12
16.142 2 OUTPUT 68.11 1.73 58.661 3 INPUT 44.094 1.12 37.402 4 OUTPUT 3.543 0.09 3.937 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION
NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe
die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be
any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be
used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE:
Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum
bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow
temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum
intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note
AN-SMX-000. LM317 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USM7905 $320/100pc. -WP $3.20 Products
sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels
to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or
custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail
DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by
SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to
revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within
support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment,
submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES
/cgi-bin/getpdf.pl?part=SMXLM317&idx=7">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com
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