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SMX LT1582 10 A, POSITIVE VOLTAGE REGULATORS same as Linear Technology LT1582, manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
SMX LT1582 10 A, POSITIVE VOLTAGE REGULATORS same as Linear Technology LT1582, manufactured by Semiconix Semiconductor - Gold chip
technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive
components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare
die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix
Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package
applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire.
REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=LT1582">INVENTORY
/cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLT1582&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE
SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMX LT1582 - BARE DIE GOLD CHIP TECHNOLOGY™ 10 A,
POSITIVE VOLTAGE REGULATORS FEATURES APPLICATIONS LDO VOLTAGE REGULATOR Low dropout performance 1.4V max Fact transient response ±2% Total
output regulation over line, load and temperature Adjust pin current max.90 µA over temperature Line regulation 0.02% Load regulation 0.3%
Microprocessor supplies, post regulators for switching supplies, high current regulators, series power supplies LT1582 LT1582 10 A,
POSITIVE VOLTAGE REGULATORS SMXLT1582 10 A, POSITIVE VOLTAGE REGULATORS - PRODUCT DESCRIPTION The SMX LT1582 high performance positive
voltage regulators designed for use in applications requiring low dropout performance at full rated current. Additionally, the SMX LT1582
provides excellent regulation over variations due to changes in line, load and temperature. Outstanding features include low dropout
performance at rated current, fast transient response, internal current limiting and thermal shutdown protection of the output device. HIGH
RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven
mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC
(System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework,
use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions
without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental
conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads
that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products
and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the
die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high
reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING
PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes.
All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts
and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film
resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.
SCHEMATIC DIAGRAM LT1582 Linear Technology LT1582 10 A, POSITIVE VOLTAGE REGULATORS LT1582 MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS
Input Voltage Vin 7 V Operating Junction Temperature Range Tj 0 to 125 °C Storage Temperature Range Tstg -65 to 150 °C ONLY Proper die
handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the
device. LT1582 ELECTRICAL CHARACTERISTIC (Unless otherwise specified, VIN=2.75V Io=10mA to 10.0 A) PARAMETER CONDITIONS SYMBOL MIN TYPE MAX
UNITS Reference Voltage (Note1) Vin=5V, Io=10mA, Tj=25°C VREF 1.238 1.250 1.262 V Reference Voltage (Note1) Vin=5V, Io=10mA, Tj over temp.
VREF 1.225 1.275 V Line Regulation (Note1) Vin=5V, Io=10mA, Tj=25°C REG(LINE) 0.015 0.2 % Line Regulation (Note1) Over Temp. REG(LINE)
0.035 Load Regulation (Note1) Vin=5V, Tj=25°C REG(LOAD) 0.1 0.3 % Load Regulation (Note1) Vin=5V, Tj=Over Temp. REG(LOAD) 0.2 0.4 Dropout
Voltage ΔVREF=1% Vin=5V, Tj=25°C Vdrop 1.1 1.4 V Dropout Voltage ΔVREF=1% Vin=5V, Tj=Over Temp. 1.2 Current Limit Tj=Over Temp. IS 10.0 12
A Temperature Coefficient Tc 0.005 %/°C Adjust Pin Current Tj=25°C Iadj 55 µA Adjust Pin Current Tj= Over Temp. 90 Adjust Pin Current
Change DIadj 0.2 5 Temperature Stability Vin=5V, Io=500mA, Tj=25°C Ts 0.5 % Minimum Load Current Vin=5V Io 5 10 mA RMS Output Noise(Note2)
Tj=25°C VN 0.003 %V Ripple Rejection Ratio(Note3) Vin=5V, Io=10A, Tj= Over Temp. RA 60 70 dB (NOTE 1) Low duty cycle pulse testing with
Kelvin connections required. (NOTE 2) Bandwidth of 10 Hz to 10kHz. (NOTE 3) 120Hz input ripple Cadj=25µF (NOTE 4) Over Temp.- over
specified operating junction temperature range. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die
size mils [mm] Bonding pads Backside metallization Silicon 10 122.05 x 129.92 ±1 [3.1 x 3.3] min 11x14 mils, 1µm thick, aluminium Backside
of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LT1582 DIE LAYOUT - MECHANICAL
SPECIFICATIONS LT1582 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 VIN x x x 2 VOUT x x x 3 VADJ x x x
SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire
bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For
soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach,
AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma
clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known
as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS
compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an
increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact
resistance and or bond failure. See Application note AN-SMX-000. LT1582 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY
Waffle Packs U/P($) USM LT1582 100pc -WP $3.20 Products sold for space, military or medical applications, element evaluation and/or level K
or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level
KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post"
target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate
as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which
may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX
products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to
support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.
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